| PART |
Description |
Maker |
| AP1333GU-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| AP2607AGY-HF AP2607AGY-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2326GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2313GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AK16D300 |
Shrink Small Outline Package SSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CO...
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| AK14D300-HSOP AK14D300-WSO AK08D300-HSOP AK08DS300 |
Small Outline Package SOIC, SOJ and PLCC DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
| MT2LDT432HG-6X MT2LDT432HG-5X MT4LDT832HG-5XS MT2L |
SMALL-OUTLINE DRAM MODULE 小外形DRAM模块
Silver Mica Capacitor; Capacitance:1200pF; Capacitance Tolerance: 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No 小外形DRAM模块
|
Micron Technology, Inc.
|
